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YOUR FUTURE RESPONSIBILITIESCoordination of infrastructure ramp up for FOWLP line at Silicon Austria labsDevelopment and optimization of FOWLP processes for both chip-first and chip-last approaches, including die placement, wafer-level molding, pr...
YOUR FUTURE RESPONSIBILITIESThis Master Thesis topic is focusing on developing a gate driver circuit with Integrated Rogowski Coil Current Sensor. The scope of the project includes following aspects: Analysis of the current implementations of the ...