Senior Scientist- Electroplating & CMP Expert for advanced packaging technologies (all genders) - // Job-ID: 160-1
Your future responsibilities R&D and optimizing electroplating processes for FOWLP, TSVs, Cu pillars, solder bumps, RDLs, etc.. R&D silicon interposers, TSV technologies and 3D stacking Material characterization & failure analysis Concept developm...