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Decreto del Rettore n. 132/2021 del 27.01.2021
Bando (PDF)
Candidatura online (LINK)
Progetto
Ricerca di applicazioni di mercato per elettronica a film sottile Valutazione dei fattori di successo tecnologici, economici, sociali ed ecologici -...
20 hours ago
| Closing on Jun 30
SOLEIL is the French national synchrotron facility, located on the Saclay Plateau near Paris. It is a multi-disciplinary instrument and a research laboratory, whose mission is to run research programs using synchrotron radiation, to develop state-of-the-art instrumentation on...
22 hours ago
| Closing on Mar 28
Tampere University and Tampere University of Applied Sciences create a unique environment for multidisciplinary, inspirational and high-impact research and education. Our universities community has its competitive edges in technology, health and society. Read...
1 day ago
| Closing on Jun 15
Max-Planck-Gesellschaft (MPG) and National Science Centre Poland (NCN) open the fourth call for Dioscuri Centres of Scientific Excellence in Poland.
The joint call by MPG and NCN is designed to establish up to three Centres of Scientific Excellence at Polish Host...
1 day ago
Upon loading and unloading wafers in nanolithography machines, friction occurs between the wafer and its support. While some friction is required to fixate the wafer, inhomogeneous deformations and stresses that occur during these positioning processes can affect the accuracy...
2 days ago
Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...
2 days ago
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system...
2 days ago
You will be responsible for developing new die bonding processes and will particicpate in research activities where Die to wafer bonding is required (3D integrated systems, image sensors, photonics, biomedical devices).
What you will do
Miniaturization of system size is a...
2 days ago
You will be responsible for developing new wafer bonding processes and participate in research activities where wafer to wafer bonding is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system size is a...
2 days ago
You will be responsible for developing new temporary wafer bonding and debonding processes and you participate in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will...
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