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Decreto del Rettore n. 132/2021 del 27.01.2021
Bando (PDF)
Candidatura online (LINK)
Progetto
Ricerca di applicazioni di mercato per elettronica a film sottile Valutazione dei fattori di successo tecnologici, economici, sociali ed ecologici -...
Sponsored
Deadline: 15 March 2021
Ref: GA/21/2
Company description
Elettra Sincrotrone Trieste is an international multidisciplinary research center operated as a user facility, featuring a 2.0/2.4 GeV, third-generation synchrotron light source (Elettra), a new free-electron laser...
14 hours ago
Contribute to next-generation neural interfaces and biomedical devices
What you will do
At imec, we craft state-of-the-art neurotechnology products that aim to advance neuroscience research. Our hardware solutions require a combination of custom ASICs, cutting-edge...
14 hours ago
Supporting R&D activities on Wafer Grinding and CMP
Miniaturization of system size is a driving force in most electronics applications. The continuous scaling of IC’s, and the advent of more compact system integration technologies make this possible. Within its affiliation...
14 hours ago
You will be responsible for developing new layer transfer processes and you are participating in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will do
Miniaturization of system...
14 hours ago
Coordinator and interface between the chip manufacturing plants and our customers
What you will do
The world of chip manufacturing is an interesting and diverse environment. Our enthusiastic and diverse team collaborates with imec’s customers to make their projects...
14 hours ago
Project leader for industrialization of new products
What you will do
Imec.IC-link, as part of imec, has an extensive industrial experience, contacts with leading industrial foundries, and long-standing relationships with all the main EDA tool vendors and IP providers....
14 hours ago
Gain eternal fame and have lots of fun
What you will do
Are you a highly motivated researcher with a strong background in analog, mixed-signal, RF, and/or mm-wave IC design? Is your ambition to work in a diverse research environment amongst some of the top researchers in...
14 hours ago
You will be responsible for developing new temporary wafer bonding and debonding processes and you participate in research activities where thin wafer processing is required (3D logic, 3D integrated systems, image sensors, biomedical devices).
What you will...
21 hours ago
| Closing on Mar 19
About the position
A fixed-term 100% position is available at the University of Agder (UiA), Faculty of Engineering and Science as a Post-Doctoral Research Fellow in ICT, affiliated to the Department of Information and Communication Technology, for a period of two years....
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