R&D Wafer-to-Wafer bonding Engineer

We are looking for an R&D bonding process engineer focused on Wafer-to-Wafer (W2W) bonding to strengthen the MAterial Transfer (MAT) team.

What you will do

Bonding processes with enhanced overlay accuracy and wafer distortion control will enable new integration options to fabricate future logic, memory, RF, photonic, imager, MEMS… devices. Bonding approaches used in layer transfer technologies allow the introduction of backside power delivery networks and even backside source contacts. Controlling and optimizing wafer distortion during bonding is essential for these applications, as overlay requirements are very tight for future technology nodes. Appropriate scanner corrections will mitigate wafer distortion partially, but bonding conditions also need to be adapted to avoid distortions over a short length scale which are difficult to correct during litho exposures. Furthermore, the bonding imprint needs to be very reproducible to enable batch corrections and increase throughput. All of these aspects will have to be assessed in detail.
As a member of the MAterial Transfer (MAT) team, you will be responsible for executing and optimizing W2W bonding processes. Furthermore, you will have to analyse metrology data obtained during bonding (e.g. bond wave) in-depth. You will have to link these bond metrology data with post-bond overlay measurements and propose W2W bonding process adjustments to minimize short range wafer distortions mainly at the wafer centre and edge regions. As an R&D process engineer you will work closely together with other researchers to push newly developed processes to a higher maturity level and, in the end, transfer these processes to imec’s pilot line. 
 
As an R&D W2W bonding Engineer you will have a significant number of responsibilities and will therefore be highly influential in helping to achieve the team’s goals and targets. 

As an R&D Engineer: 

• You will be responsible for bonding process optimization of fusion and hybrid bonding processes.
• You will construct DoE’s and summarise results focused on W2W bonding optimization. You will report progress, results, and opportunities to various organizational levels both internally as well as to customers, suppliers and partners.
• You will be expected to take a significant hands-on role within the cleanroom. You will share the ownership of the bonding process with your direct colleagues, and you will have to improve the maturity level of the bonding process.
• You will report the process of the process improvements you’re responsible for to the involved team members and discuss the results over the team boundaries. Being a team player is essential for this type of work.
• You will have to make the link between the material transfer team and the engineering department making sure to safeguard the deliverables of both Fab and research departments.

What we do for you

We offer you the opportunity to join one of the world’s premier research centers in nanotechnology at its headquarters in Leuven, Belgium. With your talent, passion and expertise, you’ll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth. 

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits. 

Who you are

• You have a Master’s or PhD degree in Physics, Chemistry, Industrial or Materials Science.
• You have a strong data analysis and/or simulation skills (e.g. Matlab, C/C++, Python, Comsol…)
• You preferentially have a working knowledge and experience with bonding processes. In best case, you even have a basic understanding of other semiconductor manufacturing areas (e.g., Lithography, Etch, CMP, etc.). Experience with litho-corrections is considered as a big plus.
• You are highly motivated and self-driven and will initiate and assume ownership of problem solving and process improvement activities.
• You are innovative and creative in finding solutions to problems.
• You are comfortable working in a team environment, but at the same time you can also work autonomously with minimal supervision when required.
• You are passionate about application development, data interpretation and are focused on achieving high quality results.
• You are highly organized and have a logical and methodical working style.
• You are eager to work in a highly competitive field and a multicultural environment. To allow you to function in this setting, you must be fluent in both written and spoken English. 
• Experience with overlay metrology is considered a plus.